★ Apply to mSAP, SAP micro blind hole, through hole resin or directly copper processing, no surface treatment step
★Using picosecond ultra-fast laser technology to solve the quality problems of traditional CO2 laser processing and the bottleneck of small hole processing with glass fiber materials
★High processing speed, precision and quality
Processing range
550 mm * 650 mm
Machining efficiency
1800 hole/sec/axis
Work table
Double axis double table
Processing capacity
30μm~80μm
Laser power
60W green light picoseconds
System machining accuracy
±12.5μm (Han's CNC condition)
Maximum scanning range of galvanometer
65 mm * 65 mm
Maximum power consumption
<15 kw
