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Dry film exposure for inner and outer layer fine lines

Product features and advantages:

★ Special machine for fine line processing, minimum analytical capacity up to 15/15μm, to meet the requirements of mSAP process

★ With independent super algorithm DMD control system, high resolution and high efficiency processing

★ Exposure process is all digital operation, enter the industry 4.0 intelligent manufacturing

Product performance
  • Maximum exposure size

    Large table: 24.5""×28.5"
    Standard table: 22""×24.5"

  • Panel thickness

    Single machine: 0.05 to 5.0 mm
    In-line: 0.075 to 2.5 mm

  • Registration accuracy

    ±10 μm

  • Interlayer alignment accuracy

    ±20 μm

  • The light source

    405nm

  • The depth of field

    ±300 μm

  • Line width precision

    ±10%

  • Fitment

    Suitable for intelligent manufacturing systems

Device installation environment
  • Max. exposure area

    Large-platform model: 24.5 in. x 28.5 in.
    Standard model: 22 in. x 24.5 in.

  • Overall dimensions (in-line, including loader/unloader)

    8542mm X 3200mm X 2200mm (L X W X H)

  • Overall size (single machine)

    3010 X 398 X 2200 (L X W X H)

  • Load demand

    750 kg/㎡

  • Demand for electricity

    3 * 380 AC + N + P, 80 A

  • Electricity power

    Single machine 4KW/ in-line machines 9KW

  • Ambient temperature and humidity

    22±1℃/55±5%

  • Environmental cleanliness

    Class 10000

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