Your current location: First page > Product > HDI > Direct imaging system
Solder mask exposure

★ Independent high laser energy DMD control technology, enhance the reliability of equipment

★ With high quality and high power composite wavelength light source, enhance the polymerization efficiency of solder mask

★ Exposure process is all digital operation, enter the industry 4.0 intelligent manufacturing

Technical parameters
  • Maximum exposure size

    Large table: 24.5"×28.5"
    Standard table: 22"×24.5"

  • Resistance welding open the window

    75 microns

  • The light source

    Composite wavelength

  • Panel thickness

    Single machine: 0.05 - 5.0 mm
    In-line: 0.1 - 3.5 mm

  • The depth of field

    ±300μm

  • Line width precision

    ±10%

  • Registration accuracy

    ±12μm

  • Fitment

    Suitable for intelligent manufacturing systems

  • Soder mask bridge capability

    50 microns

hanscnc